I would like to extend my warmest greetings to our shareholders. I am very grateful for your kind consideration and support for our company’s business activities.

We at MEC Co., Ltd. wish to extend our heartfelt sympathy to everyone affected by the Great East Japan Earthquake, and sincerely hope that they can recover and reconstruct the damaged areas very soon.

After the disaster, we had slight concerns about our customers’ production trends and the procurement of raw materials. However, the electronic components industry in Japan has started moving forward again. On the other hand, however, there is uncertainty in the market owing to factors such as the concern over credit risk caused by the monetary and fiscal problems in the US and Europe and the floods in Thailand.

Under such circumstances, we are striving more than ever to understand global trends in the entire electronics industry and customer demand in each region. In addition to strengthening our local response capabilities, we will refine our original techniques and work to develop new markets in Japan.

As specific activities for the next generation, we will apply our surface treatment techniques that we have cultivated for electronic substrates to other markets. For example, without using an adhesive this new technology can bond metals and resins, and leads to lightweight, energy-efficient, and low-cost products in a wide range of markets in addition to electronic substrates. We will work to make this technology the best in the world and have it become a pillar for our new businesses.

This January at Tokyo Big Sight we exhibited “ 2nd Automotive Weight Reduction Expo ” and it received a great response.

We will continue to make the utmost effort to meet your expectations in the future. We would appreciate your further support and encouragement.

February, 2012

 

Kazuo Maeda
CEO & President