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Pretreatment for Au/Ni Plating or HASL

MECBRITECA-5342H

It is a microetching solution available for a pretreatment for surface finish treatments such as Au/Ni plating or HASL. It can effectively remove adhesives of dry films as well as fingerprints and oxides on the surface without remaining any organic preservatives.

Removal of Solder Mask Residue

MECBRITECA-5344K

It is a microetching solution designed for the purpose of removing residue of solder mask. Moreover, it can effectively remove organic matters on copper surface such as residues of solder mask, adhesives with small etching amount.

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