Process for PCBs Fabrication Enhancement of Adhesion Microetching Solution Bleed Removal Pretreatment for Innerlayer Cu Surface Treatment for CO2 Laser Direct Drilling Selective Etching Solution Non-Cu Metal Treatment Chemicals Related to Semi-Additive Process Anti-tarnish / Rust Removal Heat Resistant OSP Etch Down Metal Resist Stripper HASL

Cleaning Performance Cleaning Performance Print Pretreatment for Au/Ni Plating or HASL MECBRITECA-5342H It is a microetching solution available for a pretreatment for surface finish treatments such as Au/Ni plating or HASL. It can effectively remove adhesives of dry films as well as fingerprints and oxides on the surface without remaining any organic preservatives. Removal of Solder Mask Residue MECBRITECA-5344K It is a microetching solution designed for the purpose of removing residue of solder mask. Moreover, it can effectively remove organic matters on copper surface such as residues of solder mask, adhesives with small etching amount.   Back to top