Process for PCBs Fabrication Enhancement of Adhesion Microetching Solution Bleed Removal Pretreatment for Innerlayer Cu Surface Treatment for CO2 Laser Direct Drilling Selective Etching Solution Non-Cu Metal Treatment Chemicals Related to Semi-Additive Process Anti-tarnish / Rust Removal Heat Resistant OSP Etch Down Metal Resist Stripper HASL

Print Pretreatment for CO2 Laser Direct Drilling MEC V-Bond DIRECTDL-7800V It is a H2SO4-H2O2 type microetching solution available for a pretreatment for CO2 laser direct drilling. Low drilling energy can be achieved, and copper splash or overhang and damage on the bottom of via holes are minimized. Post-treatment for CO2 Laser Direct Drilling MEC V-Bond DIRECTDL-7900 It is a microetching solution to effectively remove copper splash or overhang produced in CO2 laser direct process.               Back to top