Rolled annealed copper roughening treatment
(UT roughening treatment)

The uniquely-roughened copper surface topography helps to obtain excellent copper-to-resin adhesion.

MECetchBOND

UT series

UT series creates a unique roughening of rolled annealed copper.
Due to its uniquely, uniform roughened copper topography an extraordinary copper-to-resin adhesion is achieved.
UT series is widely applicable where a high level of adhesion is required, such as pre-treatment for build-up resin lamination, dry film lamination or solder mask application.

Surface observation

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