These H2SO4-H2O2 type microetching agents help to activate the copper surface as well as to remove oxide on the surface. They are available as a pretreatment for a final process such as HASL or heat-resistant OSP, or for dry film lamination. They are also effective in via bottom cleaning and NiAu pretreatment for Ni-Au plating. MECBRITE CB-5602AY can eliminate buff-scrubbing marks with etching.
MECBRITE CB-5602AY etching
By evenly etching the via bottom,
smear and micro sized metal residue can be removed.
This slightly alkaline microetching agent reduces the risk of through-hole disconnection. It is suitable as a pretreatment for a final process such as HASL or heat-resistant OSP, as well as for treatment of copper & tin-lead co-existing substrates.