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Solder Mask Pretreatment/Dry film Pretreatment
MECBRITECB-5002C, CB-5004, CB-5008, CB-5530,CB-5532
It is a H2SO4 - H2O2 type microetching agent which produces unique copper topography with a small etching amount. It is suited for pretreatment for dry film lamination and solder mask and enhances the adhesion.
Also, it is a cost-efficient product due to a large amount of copper holding capacity and excellent stability of hydrogen peroxide.
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Reduce Disconnection of Small Holes
MECBRITESF-5420
It is a weakly alkaline type microetching agent which is available for a pretreatment for the final process such as HASL or OSP. In addition to it, it is possible to treat even a multi-metal surface panel (copper & tin-lead). A disconnection of small holes can be reduced.
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General Use
MECBRITECA-92Y, CB-803MY, CB-5602AY
It is a H2SO4 - H2O2 type microetching agent which is available for a pretreatment for the final process such as HASL or OSP, or for dry film lamination.
As well as removing oxides on copper surface, it helps to activate the surface. |
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