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Products Information

General Use

MECBRITECA-90 Series /CB-800 Series /
CB-5600 Series

It is a H2SO4-H2O2 type microetching agent which is available for a pretreatment for the final process such as HASL or OSP, or for dry film lamination. As well as removing oxides on copper surface, it helps to activate the surface.

Reduction of Small Holes Disconnection

MECBRITESF-5420

It is a weakly alkaline type microetching agent which is available for a pretreatment for the final process such as HASL or OSP. In addition to it, it is possible to treat even a multi-metal surface panel (Copper & tin-lead). A disconnection of small holes can be reduced.

Pretreatment for Dry Film Lamination

MECBRITECB-5000 Series

It is a H2SO4 type microetching agent which produces unique copper topography with a small etching amount, and best suited for a pretreatment for dry film lamination.Also, it is a cost-efficient product due to a large amount of copper holding capacity and excellent stability of hydrogen peroxide.

Pretreatment for Solder Mask

MECBRITECB-5000 Series

It is a H2SO4-H2O2 type microetching agent to produce unique copper topography which provides higher adhesion to solder mask.

 

 

 

 

 

 

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