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General Use
MECBRITECA-90 Series /CB-800 Series /
CB-5600 Series
It is a H2SO4-H2O2 type microetching solution which is available for a pretreatment
for the final process such as HASL or OSP, or for dry film lamination. As well
as removing oxides on copper surface, it helps to activate the surface. |
Reduction of Small Holes Disconnection
MECBRITESF-5420
It is a weakly alkaline type microetching solution which is available for
a pretreatment for the final process such as HASL or OSP. In addition to it,
it is possible to treat even a multi-metal surface panel (Copper & tin-lead).
A disconnection of small holes can be reduced.
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Pretreatment for Dry Film Lamination
MECBRITECB-5002C
It is a H2SO4-H2O2 type microetching solution which produces unique copper
topography with a small etching amount, and best suited for a pretreatment for
dry film lamination. Also, it is a cost-efficient product due to a large amount
of copper holding capacity and excellent stability of hydrogen peroxide. |
 
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