Process for PCBs Fabrication Enhancement of Adhesion Microetching Solution Bleed Removal Pretreatment for Innerlayer Cu Surface Treatment for CO2 Laser Direct Drilling Selective Etching Solution Non-Cu Metal Treatment Chemicals Related to Semi-Additive Process Anti-tarnish / Rust Removal Heat Resistant OSP Etch Down Metal Resist Stripper HASL

MECetchBOND Process Print Pretreatment MECBRITECA-5330A It is a pretreatment agent for MECetchBOND CZ. MECetchBOND's performance can be maximized by effectively removing inhibitors on copper surface which may interrupt the effects of MECetchBOND, e.g. adhesives of dry films, fingerprints or oxide matters. Roughening MECetchBONDCZ-8100/CZ-8101 It is a microetching solution which produces super-roughened topography on copper surface. The unique topography helps to enhance adhesion of copper to resin. It widely available for processes where a high degree of adhesion is required, e.g. a pretreatment for build-up resin lamination, dry film lamination or solder mask application. Enhancing Adhesion of Copper & Anti-tarnish MECetchBONDCL-8300/CL-8301 It is an anti-tarnish agent to provide superior heat resistance and moisture resistance to super-roughened copper surface topography produced by MECetchBOND CZ. As well as protecting the copper surface from oxidization, it produces organic film that helps to enhance adhesion of copper to high Tg resins. In addition to it, CL-8301provides higher adhesion to FR-4.               Back to top