MEC V-BondBO-7770V

It is a H2SO4-H2O2 type microetching solution developed as an alternative to chemical for black oxide treatment. Both conveyor and batch systems are available. Unique surface topography produced by V-Bond can enhance adhesion of copper to resins such as high Tg or HF (Halogen Free).

Pretreatment for MEC V-Bond

MEC V-BondCB-7612H

It is a pretreatment agent for MEC V-BOND BO. MEC V-Bond's performance can be maximized by removing rust or grease on copper surface appropriately.