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Quick Etching
(For Cu Seed Layer)
MECBRITEVE-7100
It is an etching solution that selectively etches copper only without damaging
other metals such as tin, tin-lead or nickel on boards with bumps.
MECBRITECI-7200
It is a H2SO4 - H2O2 type etching solution suitable for particularly fine
patterns etching since it can minimize an occurrence of undercut. Superior stability
of hydrogen peroxide is provided.
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