Chemicals for Semi-Additive Proccess Enhancement of Adhesion Pretreatment for Innerlayer Cu Surface Treatment for CO2 Laser Direct Drilling Microetching Solution Heat Resistant OSP Etch Down Bleed Removal Anti-tarnish / Rust Removal Metal Resist Stripper HASL(for Pb free) Chart of Compatibility Selective Etching Solution Roughening & Others

Print Cu Seed Layer Removal MECBRITECI-7200 Series It is a H2SO4 - H2O2 type etching solution suitable for particularly fine patterns etching since it can minimize an occurrence of undercut. Superior stability of hydrogen peroxide is provided. It is applicable as Cu seed layer removal for SAP and M-SAP processes. Palladium (Pd) Catalyst Residues Remover MEC REMOVERPJ-9720 It is a palladium (Pd) catalyst residues remover for the Semi Additive Process (SAP) which removes the palladium catalyst residues left on the surface of the insulating resin without dissolving copper interconnects and greatly improves the insulation reliability.             Back to top