• - Can minimize the dimensional change of base materials because the treatment is free from mechanical stress.
  - Is suitable for processing thin materials or materials that are ‘nervous’ about dimensional change.
• Produces complex and unique surface topographies that mechanical polishing, such as brushing, cannot create.
• Can produce a roughened surface uniformly with intricate, three-dimensionally formed shapes.
• Increases surface roughness (Ra, Rz) and surface area.

• Reinforces the adhesive strength of metal to other materials, such as resins.
  - Improves the adhesion of metals to coating films (paint)
• Adds design characteristics through the modification of appearance.
• Antireflection (gloss reduction)
• Adds and enhances functionality by increasing surface area.
• Improves wettability.

MEC has been a chemical supplier for the fabrication of Printed Circuit Boards for more than 40 years since its establishment.
In particular, MEC remains the leader in the sale of copper surface treatment solutions for IC packages with its core technologies in copper surface treatment techniques.