Solder mask pretreatment
Excellent adhesion to solder mask creates an accurate pattern/mask formation.
These organic acid-type microetching solutions create a super-roughened copper surface. The unique copper surface topography helps to achieve high copper-to-resin adhesion. As copper surface roughening agents, CZ-8100 and CZ-8101 are widely available for processes where a high level of adhesion is required, such as pretreatment for build-up resin lamination, dry film lamination or solder mask application.
Surface topography, SM adhesion (after gold plating), etching amount
SM test pattern development
Electroless Ni-Au plating
Dipping in a 10%-hydrochloric acid solution for 10 minutes
*Electroless Ni-Au condition
Plating solution: Non-cyanide type
Condition: Ni 85-90°C, 15 min. Au 85°C, 8 min.
Contact us first.
We will suggest the product best suited to your needs.