MEC Co., Ltd. contributes to the advancement and sophistication of electronics products through the creation of “surface,” the interface where a substance has contact with another substance.

The surface has a substantial impact on the performance of electronics products.
In forming an electronic circuit, adhesion between copper and resin is highly important.

Our products dramatically improve adhesion strength by melting or reforming a metal surface to give added value, thereby creating the interface surface at which the metal is bonded to resin or other metal.