Adhesion enhancement technology
MEC’s core technology.
It is expected to further expand, in response to advancement of performance of electronic products with reduced size and weight, and higher frequency.

Fine wiring formation technology
It is a proven technology in the COF field.
This technology is expected to be applied to flexible substrates and mother boards.

Surface treatment technology
It is employed for pre-treatment processes of copper in electronic substrates.
Broadening the application of this technology,
MEC aims to promote the use of this technology into various fields,
such as surface roughening of metals other than copper and selective etching.

With these technologies,
MEC supports the further development of electronic boards and components.