Pre-treatment for laser direct drilling
MEC V-Bond BO-7790V
BO-7790V is a H2SO4-H2O2 type microetching agent.
It creates a surface topography that increases the energy absorption rate of the direct laser used.
Post-treatment for laser direct drilling
MEC PowerETCH HE-7002A
A microetching agent that efficiently removes copper splatters and burrs generated during direct laser processing using a CO2 laser.
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