HE-7000Y / HE-7002A
This H2SO4-H2O2 type microetching agent is available for etch down processes in which a large amount of copper is dissolved. This process shows excellent performance for copper reduction by 50% or more. In particular, it is suitable as pretreatment of substrates for fine pattern formation.
H2O2 decomposition rate in solution after 24 hours
Contact us first.
We will suggest the product best suited to your needs.