Etch down


HE-7000Y / HE-7002A

This H2SO4-H2O2 type microetching agent is available for etch down processes in which a large amount of copper is dissolved. This process shows excellent performance for copper reduction by 50% or more. In particular, it is suitable as pretreatment of substrates for fine pattern formation.

H2O2 decomposition rate in solution after 24 hours

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