Pre-lamination treatment for multilayer substrates (alternative to black oxide treatment)
Environment-friendly process developed as an alternative to black oxide treatment.
This H2SO4-H2O2 type microetching agent is developed as an alternative to black oxide treatment and can improve the adhesion of copper to FR-4, as well as high Tg or halogen-free materials.
Features of MEC V-Bond BO-7790V
- Can create a surface topography with high reflow-resistance.
- Performs etching on copper surfaces to create a roughened topography (anchor effect) while forming an organic copper film on the surface (primer effect).
- Helps to achieve high adhesion to FR-4, as well as high Tg or halogen-free materials.
Pretreatment for pre-lamination treatment MEC V-Bond CB-7612, MECBRITE CA-5370
MEC V-Bond CB-7612 and MECBRITE CA-5370 are pretreatment agents that maximize the effect of MEC V-Bond by removing rust or dirt on copper surfaces. MECBRITE CA-5370 is particularly effective in removing smut after pattern formation.
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