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Other metal surface treatment

Selective etching table

The following table shows the metal combinations for which selective etching can be performed.

  • S

    Applicable(no etching for protected objects)

  • S

    Applicable (no etching for protected objects)

  • A

    Applicable(etching rate ratio is 10 times or more)

  • B

    Applicable (others)

  • Not applicable

Metal for etching (to be removed)
Al Zn Fe Co Ni Sn In Bi Cu Pd W Mo cITO NiCr
(Cr20%)
SUS304
Metal for protection (to be left or protected) Al A A S A A S A S S S
Zn A
Fe S A S B S S S S S
Co A A A A A.S S S S
Ni S A S A A A S S S S
Sn A S S S S S
In A A A B A S
Bi A A S B S S S S
Cu A A A A A B
Pd S S S S S S S S S S S A A
W S S S S S S S S S S S S S S
Mo S A A A A A A A.S A A A
Ag S S S S S S S S S S S
Pt S S S S S S S S S S S S S S S
Au S S S S S S S S S S S S S S S
Si S S S S S S S S S S S S S S S
Ti S S S S S S S S S S S S S S S
Ta S S S S S S S S S S S S S S S
Nb S S S S S S S S S S S S S S S
clTO S S S S S S S S S S S S S S
NiCr
(Cr20%)
S S S S S S S S S S S S
SUS304 S S S S S S S S S S S S
  • Selective etching may be not avalible depending on the components of substrate. SUS304 and SUS316 and SUS430 have a similar trend.
  • Without asking for details, it may be difficult to determine whether selectively etching is avalible or not. Please contact us first.

Selective etching

This is an etching technology that dissolves a specific metal when two or more different metals coexist, without affecting (or melting) the other metals.

Nickel-chromium alloy remover
MEC REMOVER CH series

From the copper and nickel-chromium co-existing substrate, nickel-chromium alloy can be selectively etched without damaging the copper surface. The CH series is useful for removing nickel-chromium film residue or etching the embedded resistance film on a 2-layer, sputter-type flexible substrate.

Etching example
ニッケル-クロム合金除去剤 メックリムーバー CHシリーズ

Nickel remover
MEC REMOVER NH-1860 series

This series performs selective etching of nickel on the copper and nickel co-existing substrate without damaging the copper surface. It is useful in forming copper posts using nickel as a barrier layer or in forming patterns through reverse transfer process using nickel as a base metal.

Etching example
ニッケル除去剤 メックリムーバー NH-1860シリーズ

Copper remover
MECBRITE SF series

This slightly alkaline etching agent is able to etch copper without damaging co-existing nickel or solder.

Etching example
銅除去剤 メックブライト SF-5420

Aluminum remover
MEC aluminum smoothing agent AS-1250

This is an alkaline type etching solution to form a smooth aluminum surface by removing burr or scratches on aluminum surfaces. It does not damage copper surface.

Etching example
アルミニウム除去剤 メックアルブライト AS-1250

Dissimilar metal roughening,selective roughening

Other metal roughening
MEC NICKEL ROUGHENER
NR series(Under development)

This etching solution produces a unique surface topography having a superior anchor effect by etching a nickel surface. It is useful as a pretreatment agent for dry film lamination on the nickel surface.

Etching example
異種金属粗化 ニッケル メックニッケルラフナー NRシリーズ(開発中)

Selective roughening
MECetchBOND CZ-8500

This slightly alkaline etching agent enables etching of copper film without damaging co-existing nickel or solder.

Etching example
選択粗化 メックエッチボンド CZ-8500
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