MEC COMPANY will exhibit at the exhibition held in conjunction with the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), an international conference on semiconductor packaging technologies.
Conference Dates: May 26(Tue.)-May 29(Fri.), 2026
Exhibition Dates: May 27(Wed.)-May 28(Thu.), 2026
Venue: JW Marriott & The Ritz-Carlton Grande Lakes Resort
4040 Central Florida Parkway, Orlando, Florida, USA, 32837
Booth No.:1304
Exhibits: Ultra-Roughening Adhesion Enhancement Process (CZ Roughening Process)
Organic Film-Based Adhesion Enhancement Process
Adhesion Enhancement Processes for Glass-to-Resin and Copper-to-Resin Interfaces
Surface Treatment for Fluxless TCB Bonding
Conference Dates: May 26(Tue.)-May 29(Fri.), 2026
Exhibition Dates: May 27(Wed.)-May 28(Thu.), 2026
Venue: JW Marriott & The Ritz-Carlton Grande Lakes Resort
4040 Central Florida Parkway, Orlando, Florida, USA, 32837
Booth No.:1304
Exhibits: Ultra-Roughening Adhesion Enhancement Process (CZ Roughening Process)
Organic Film-Based Adhesion Enhancement Process
Adhesion Enhancement Processes for Glass-to-Resin and Copper-to-Resin Interfaces
Surface Treatment for Fluxless TCB Bonding