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Chemicals for electronic substrates
- Super-roughening type adhesion enhancement(CZ roughening treatment)
- Adhesion enhancement for high-frequency substrates
- Rolled annealed copper roughening treatment(UT roughening treatment)
- Pre-lamination treatment for multilayer substrates(alternative to black oxide treatment)
- Anisotropic etching
- Other metal surface treatment
- Seed layer etching
- DFR pre-treatment
- Copper surface treatment for CO2 laser direct drilling
- Microetching
- Etch down
- Various residue removal treatments
- Degreasing, rust removal, temporary anti-tarnish
- AMALPHA : Resin-to-metal bonding technology from MEC