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Other metal surface treatment

Technologies and know-how for selective etching of various metals and microetching of copper, are obtained many years of research and development. These technologies can be used in a wide range of market needs.

These etching technologies can remove a specific metal without affecting (etching) other co-existing metals.

Nickel-chromium alloy remover
MEC REMOVER

CH series

From the copper and nickel-chromium co-existing substrate, nickel-chromium alloy can be selectively etched without damaging the copper surface. The CH series is useful for removing nickel-chromium film residue or etching the embedded resistance film on a 2-layer, sputter-type flexible substrate.

Etching example

Nickel remover
MEC REMOVER

NH-1860 series

This series performs selective etching of nickel on the copper and nickel co-existing substrate without damaging the copper surface. It is useful in forming copper posts using nickel as a barrier layer or in forming patterns through reverse transfer process using nickel as a base metal.

Etching example

Copper remover
MECBRITE

SF-5420

This slightly alkaline etching agent is able to etch copper without damaging co-existing nickel or solder.

Etching example

Aluminum remover
MEC aluminum smoothing agent

AS-1250

This is an alkaline type etching solution to form a smooth aluminum surface by removing burr or scratches on aluminum surfaces. It does not damage copper surface.

Etching example

Please select the metal combination on which you intend to apply selective etching.

Metal for protection
(to be left or protected)
Metal for etching
(to be removed)
Judgment
 

Select the first metal.


Inquiry about products



This is a table of metal combinations to which selective etching is applicable.

エッチング対象金属(取り除きたい)
AlAluminum ZnZinc FeIron CoCobalt NiNickel SnTin InIndium BiBismuth
保護対象金属(残したい、保護したい) AlAluminum  
ZnZinc              
FeIron    
CoCobalt      
NiNickel  
SnTin          
InIndium      
BiBismuth      
CuCopper      
PdPalladium
WTungsten
MoMolybdenum
AgSilver
PtPlatinum
AuGold
SiSilicon
TiTitanium
TaTantalum
NbNiobium
cITOcrystal Indium Tin Oxide
Ni-Cr(Cr20%)Nickel-Chromium
SUS304

エッチング対象金属(取り除きたい)
CuCopper PdPalladium WTungsten MoMolybdenum cITOCrystal Indium Tin Oxide Ni-Cr(Cr20%)
Nickel-Chromium
SUS304
保護対象金属(残したい、保護したい) AlAluminum        
ZnZinc              
FeIron        
CoCobalt        
NiNickel        
SnTin        
InIndium            
BiBismuth        
CuCopper            
PdPalladium    
WTungsten  
MoMolybdenum        
AgSilver        
PtPlatinum
AuGold
SiSilicon
TiTitanium
TaTantalum
NbNiobium
cITOcrystal Indium Tin Oxide  
Ni-Cr(Cr20%)
Nickel-Chromium
     
SUS304      
  • Applicable, please contact us.
  • GrayWe are sorry, not applicable.

*Selective etching may not be applicable depending on the components of the substrate.
SUS304, SUS316 and SUS430 are similar trends.

*Whether selective etching is applicable or not may be determined only after the details of the desired treatment are clarified. So please contact us first.

Other metal roughening
MEC NICKEL ROUGHENER

NR series(Under development)

This etching solution produces a unique surface topography having a superior anchor effect by etching a nickel surface. It is useful as a pretreatment agent for dry film lamination on the nickel surface.

Etching example

Selective roughening
MECetchBOND

CZ-8500

This slightly alkaline etching agent enables etching of copper film without damaging co-existing nickel or solder.

Etching example

Contact us first.

We will suggest the product best suited to your needs.

Inquiry about products

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