MECetchBOND UT series
- UT series creates a unique roughening of rolled copper.
Due to its uniquely, uniform roughened copper topography an extraordinary copper-to-resin adhesion is achieved. - UT series is widely applicable where a high level of adhesion is required, such as pre-treatment for build-up resin lamination, dry film lamination or solder mask application.
Surface observation
| Untreated | |
|---|---|
| Electrolytic copper foil |
Rolled copper foil |
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| H2SO4-H2O2 type：0.5μm | |
|---|---|
| Electrolytic copper foil |
Rolled copper foil |
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| UT-4100：0.5μm | |
|---|---|
| Electrolytic copper foil |
Rolled copper foil |
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| UT-4120：0.8μm | |
|---|---|
| Electrolytic copper foil |
Rolled copper foil |
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Performance
DFR adhesion
UT-4100 improves the adhesion with DFR.
| Untreated | |
|---|---|
| Tip | Corner |
 |
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| H2SO4-H2O2 type：0.5μm | |
|---|---|
| Tip | Corner |
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| UT-4100：0.5μm | |
|---|---|
| Tip | Corner |
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- Copper foil: Hyper anneal copper foil (HA foil)
Process flow: UT-4100 treatment → DFR patterning (L/S=40/40μm)
Wiring linearity / Appearance uniformity
UT series improves the pattern linearity and appearance uniformity
| Untreated | |
|---|---|
| SEM | Metal microscope |
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| H2SO4-H2O2 type：0.5μm | |
|---|---|
| SEM | Metal microscope |
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| UT-4100 0.5µm | |
|---|---|
| SEM | Metal microscope |
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- Copper foil: Hyper anneal copper foil
Process flow: UT-4100 treatment → DFR patterning → Etching → DFR stripping
Solder mask adhesion
UT-4120 improves the adhesion performane against solder mask.
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