Rolled copper roughening treatment
(UT roughening treatment)
The uniquely-roughened copper surface topography helps to obtain excellent copper-to-resin adhesion.
MECetchBOND
UT series
UT series creates a unique roughening of rolled copper.
Due to its uniquely, uniform roughened copper topography an
extraordinary copper-to-resin adhesion is achieved.
UT series is widely applicable where a high level of adhesion is
required, such as pre-treatment for build-up resin lamination, dry film
lamination or solder mask application.
Surface observation
