Chemicals for electronic substrates
Search by Purpose
Purpose | |
Super-roughening type adhesion enhancement (CZ roughening treatment) | |
Rolled copper roughening treatment (UT roughening treatment) |
|
Pre-lamination treatment for multilayer substrates (alternative to black oxide treatment) |
|
Copper surface treatment for CO2 laser direct drilling | |
Adhesion improvement for high-frequency substrates | |
Dry film pretreatment | |
Solder mask pretreatment | |
Microetching | |
Etch down | |
Various residue removal treatments | |
Degreasing, rust removal, temporary anti-tarnish | |
Metal resist stripping | |
HALS | |
Copper seed layer etching | |
Other metal surface treatment | |
Anisotropic etching |
Search by Product Name
MECBRITE | ||
---|---|---|
Product name | Purpose | |
CA-5330A | Super-roughening type adhesion enhancement (CZ roughening treatment) | |
CA-5370 | Pre-lamination treatment for multilayer substrates (alternative to black oxide treatment) | |
Degreasing, rust removal, temporary anti-tarnish | ||
CA-5330 series | Various residue removal treatments | |
CA-5302 | Degreasing, rust removal, temporary anti-tarnish | |
CA-5372 | Degreasing, rust removal, temporary anti-tarnish | |
CB-5000 series | Dry film pretreatment | |
CB-5602AY, CB-801Y | Microetching | |
CB-5552A | Metal resist stripping | |
CI-7200 series | Copper seed layer etching | |
EXE series | Anisotropic etching | |
SF-5420 | Microetching | |
Selective etching | ||
CAU-5232C | Degreasing, rust removal, temporary anti-tarnish | |
CAU-5214, CAU-5216, CAU-5220 | Degreasing, rust removal, temporary anti-tarnish | |
QE-7300 | Copper seed layer etching | |
MECetchBOND | ||
Product name | Purpose | |
CL-8300 series | Super-roughening type adhesion enhancement (CZ roughening treatment) | |
CZ-8000 series | Super-roughening type adhesion enhancement (CZ roughening treatment) | |
CZ-8100, CZ-8101 | Solder mask pretreatment | |
CZ-8500 | Other metal roughening, selective roughening | |
STZ-3100 | Dry film pretreatment | |
UT series | Rolled copper roughening treatment (UT roughening treatment) |
|
MEC V-Bond | ||
Product name | Purpose | |
BO-7790V | Pre-lamination treatment for multilayer substrates (alternative to black oxide treatment) | |
MEC REMOVER | ||
Product name | Purpose | |
CH series | Selective etching | |
S-1728 | Metal resist stripping | |
S-651A, S-651B | Metal resist stripping | |
S-1022 | Metal resist stripping | |
NH-1860 series | Metal resist stripping | |
Selective etching | ||
PJ-9720 | Copper seed layer etching | |
MEC PowerETCH | ||
Product name | Purpose | |
HE-7000Y | Etch down | |
HE-7002A | Etch down | |
Copper surface treatment for CO2 laser direct drilling | ||
MEC ALBRITE | ||
Product name | Purpose | |
AS-1250 | Selective etching | |
MEC NICKEL ROUGHENER | ||
Product name | Purpose | |
NR series | Other metal roughening, selective roughening | |
FlatBOND | ||
Product name | Purpose | |
GT Process | Adhesion improvement for high-frequency substrates |