Chemicals for electronic substrates
Search by Purpose
| Purpose | |
| Super-roughening type adhesion enhancement (CZ roughening treatment) | |
| Rolled copper roughening treatment (UT roughening treatment) |
|
| Pre-lamination treatment for multilayer substrates (alternative to black oxide treatment) |
|
| Copper surface treatment for CO2 laser direct drilling | |
| Adhesion improvement for high-frequency substrates | |
| Dry film pretreatment | |
| Solder mask pretreatment | |
| Microetching | |
| Etch down | |
| Various residue removal treatments | |
| Degreasing, rust removal, temporary anti-tarnish | |
| Metal resist stripping | |
| HALS | |
| Copper seed layer etching | |
| Other metal surface treatment | |
| Anisotropic etching |
Search by Product Name
| MECBRITE | ||
|---|---|---|
| Product name | Purpose | |
| CA-5330A | Super-roughening type adhesion enhancement (CZ roughening treatment) | |
| CA-5370 | Pre-lamination treatment for multilayer substrates (alternative to black oxide treatment) | |
| Degreasing, rust removal, temporary anti-tarnish | ||
| CA-5330 series | Various residue removal treatments | |
| CA-5302 | Degreasing, rust removal, temporary anti-tarnish | |
| CA-5372 | Degreasing, rust removal, temporary anti-tarnish | |
| CB-5000 series | Dry film pretreatment | |
| CB-5602AY, CB-801Y | Microetching | |
| CB-5552A | Metal resist stripping | |
| CI-7200 series | Copper seed layer etching | |
| EXE series | Anisotropic etching | |
| SF-5420 | Microetching | |
| Selective etching | ||
| CAU-5232C | Degreasing, rust removal, temporary anti-tarnish | |
| CAU-5214, CAU-5216, CAU-5220 | Degreasing, rust removal, temporary anti-tarnish | |
| QE-7300 | Copper seed layer etching | |
| MECetchBOND | ||
| Product name | Purpose | |
| CL-8300 series | Super-roughening type adhesion enhancement (CZ roughening treatment) | |
| CZ-8000 series | Super-roughening type adhesion enhancement (CZ roughening treatment) | |
| CZ-8100, CZ-8101 | Solder mask pretreatment | |
| CZ-8500 | Other metal roughening, selective roughening | |
| STZ-3100 | Dry film pretreatment | |
| UT series | Rolled copper roughening treatment (UT roughening treatment) |
|
| MEC V-Bond | ||
| Product name | Purpose | |
| BO-7790V | Pre-lamination treatment for multilayer substrates (alternative to black oxide treatment) | |
| MEC REMOVER | ||
| Product name | Purpose | |
| CH series | Selective etching | |
| S-1728 | Metal resist stripping | |
| S-651A, S-651B | Metal resist stripping | |
| S-1022 | Metal resist stripping | |
| NH-1860 series | Metal resist stripping | |
| Selective etching | ||
| PJ-9720 | Copper seed layer etching | |
| MEC PowerETCH | ||
| Product name | Purpose | |
| HE-7000Y | Etch down | |
| HE-7002A | Etch down | |
| Copper surface treatment for CO2 laser direct drilling | ||
| MEC ALBRITE | ||
| Product name | Purpose | |
| AS-1250 | Selective etching | |
| MEC NICKEL ROUGHENER | ||
| Product name | Purpose | |
| NR series | Other metal roughening, selective roughening | |
| FlatBOND | ||
| Product name | Purpose | |
| GT Process | Adhesion improvement for high-frequency substrates | |
