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Adhesion enhancement for high-frequency substrates

FlatBOND
GT Process

Features of GT Process

  • Unaccompanied by etching or surface roughening, there is almost no difference in the conductor shape before and after treatment.
  • Little transmission loss in the high-frequency range.
  • Excellent adhesion to low-dielectric materials used for high-frequency substrates.

Mobile Communication Network Roadmap vs. MEC’s Technology

High speed of mobile communication network
移動通信ネットワークの高速化のグラフ
Surface topography
表面形状の画像
Transmission loss
伝送損失のグラフ
  • Cooperation: Institute of Microelectronics Assembling and Packaging, Fukuoka University Fukuoka Industry, Science & Technology Foundation Reserch Center for Three-Dimensional Semiconductors
Peel strength
ピール強度のグラフ
  • CL-8301 is a temporary rust inhibitor for copper surfaces.
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  1. Products
  2. Chemicals for electronic substrates
  3. Adhesion enhancement for high-frequency substrates