Adhesion enhancement for high-frequency substrates
FlatBOND
GT Process
Features of GT Process
- Unaccompanied by etching or surface roughening, there is almost no difference in the conductor shape before and after treatment.
- Little transmission loss in the high-frequency range.
- Excellent adhesion to low-dielectric materials used for high-frequency substrates.
Transmission loss
Adhesion
Surface topography
Pattern shape
