FlatBOND
GT Process
Features of GT Process
- Unaccompanied by etching or surface roughening, there is almost no difference in the conductor shape before and after treatment.
- Little transmission loss in the high-frequency range.
- Excellent adhesion to low-dielectric materials used for high-frequency substrates.
Mobile Communication Network Roadmap vs. MEC’s Technology
High speed of mobile communication network
![移動通信ネットワークの高速化のグラフ](img/graph_network.png)
Surface topography
![表面形状の画像](img/img_surface.png)
Transmission loss
![伝送損失のグラフ](img/graph_transmission.png)
- Cooperation: Institute of Microelectronics Assembling and Packaging, Fukuoka University Fukuoka Industry, Science & Technology Foundation Reserch Center for Three-Dimensional Semiconductors
Peel strength
![ピール強度のグラフ](img/graph_peel.png)
- CL-8301 is a temporary rust inhibitor for copper surfaces.
Contact us first.
Inquiry about products
We will suggest the product best suited to your needs.