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Adhesion enhancement for high-frequency substrates

FlatBOND

GT Process

Features of GT Process

  • Unaccompanied by etching or surface roughening, there is almost no difference in the conductor shape before and after treatment.
  • Little transmission loss in the high-frequency range.
  • Excellent adhesion to low-dielectric materials used for high-frequency substrates.

Transmission loss

Adhesion

Surface topography

Pattern shape

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