Etch down

HE-7002A is H₂SO₄-H₂O₂ type microetching agent that is available for etch down processes for high copper concentration capacity.
This is an additive type agent that is available to adjust the etching rate based on etching asmount requirement and tool conditions.
HE-7002A realize homogeneous surface treatment, and creates smooth copper surafce.
It inhibits decomposition of hydrogen peroxide and realize stabilized etching rate.

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