These H2SO4-H2O2 type microetching agents help to activate the copper surface as well as to remove oxide on the surface. They are available as a pretreatment for a final process such as HAL or heat-resistant OSP, or for dry film lamination. They are also effective in via bottom cleaning and NiAu pretreatment for Ni-Au plating. This series can eliminate buff-scrubbing marks with etching.
Reducing disconnection of small holes
This series is a neutral to slightly alkaline microetching agent. It reduces the risk of through-hole disconnection. It is suitable as a pretreatment for final finishing such as HAL and thermal resistant OSP, and also for treatment for copper-solder mixed-metal boards.
We will suggest the product best suited to your needs.