Copper seed layer etching

Here is a H2SO4-H2O2 type etching solution for copper seed layer that can minimize undercut and the reduction in line width, creating the desired pattern formation. It is available as a copper seed layer remover for SAP process.

MECBRITE

QE-7300

This H2SO4-H2O2 type quick etching solution is suitable for copper seed layer etching in SAP to form fine patterns.

Features of MECBRITE QE-7300

  • Minimizes reduction in line width.
  • Can obtain desired patterns with minimal undercut.
  • Its etching rate can be adjusted according to the desired productivity because it is an additive type.

Examples of pattern formation

25 μm pitch
Seed layer: electroless copper 1 μm

Here is a H2SO4-H2O2 type etching solution for copper seed layer that can minimize undercut and the reduction in line width, creating the desired pattern formation. It is available as a copper seed layer remover for M-SAP process.

MECBRITE

CI-7200

This H2SO4-H2O2 type etching solution is suitable for copper seed layer etching in M-SAP to form fine patterns.

Features of MECBRITE CI-7200

  • Can obtain desired patterns with minimal undercut.
  • Minimizes reduction in line width because of its excellent etching performance on copper foil.
  • Available as a copper seed layer remover for SAP and M-SAP.
  • Its etching rate can be adjusted according to the desired productivity because it is an additive type.

Treatment steps

Examples of pattern formation

50 μm pitch
Seed layer: Cu foil 3 μm + electroless Cu 1 μm

This is a remover of palladium (Pd) catalyst residues left on the surface of the insulating resin in the SAP.

MEC REMOVER

PJ-9720

This hydrochloric acid-type Pd catalyst residue remover is particularly suitable for removing the Pd catalyst residues left on the surface of the insulating resin in the SAP.

Features of MEC REMOVER PJ-9720

  • Can selectively remove Pd catalyst without damaging the conductor pattern.
  • Greatly improves insulation reliability.
  • Inhibits abnormal deposition of electroless Ni plating.
  • Can be used for both dipping and spraying applications.
  • Can be used at relatively low temperatures (25°C to 40°C).
  • Automatic control and feeding is available.

Deposition of electroless nickel on the resin

Relationship between dwell time and detected Pd intensity (40°C spraying)

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