1. Products
  2. Chemicals for electronic substrates
  3. Pre-lamination treatment for multilayer substrates (alternative to black oxide treatment)

Pre-lamination treatment for multilayer substrates

(alternative to black oxide treatment)

MEC V-Bond BO-7790V Flood-immersion BO-7710V Spray

Features of MEC V-Bond

  • MEC V-Bond is a H2SO4-H2O2 microetching agents which is devoloped as alternative to black oxide treatment to reduce enviroment impact.
  • Performs etching on copper surfaces to create a roughened topography (anchor effect) while forming an organic copper film on the surface (primer effect) to achive the high adhension and heat resistance of resin.
  • Helps to achieve high adhesion to FR-4, as well as high Tg or halogen-free materials.
  • We can offer the most suitable chemical solution according to the customer's application, such as BO-7790V for flood-immersion treatment and BO- 7710V for spray treatment.
Surface topography
BO-7790V 2.0μm BO-7710V 1.0μm
Peel strength
Cross-section observation
Initial
Black oxide reduction BO-7790V
(2.0μm etching)
After reflow
Black oxide reduction BO-7790V
(2.0μm etching)
  • After reflow:80℃,85%RH,96hr→Pb free reflow(Max.260℃)2pass
Pre-treatment for pre-lamination treatment
  • Pre-treatment MEC V-Bond CB-7612
    MECBRITE CA-5370,
    CA-5372
  • Pre-lamination treatment MEC V-Bond BO-7790V
    MEC V-Bond BO-7710V

MEC V-Bond CB-7612 and MECBRITE CA-5370 and CA-5372 are pre-treatment agents that maximize the effect of MEC V-Bond by removing rust or dirt on copper surfaces. MECBRITE CA-5370 and CA-5372 are particularly effective in removing smut after pattern formation.

Contact us first.

We will suggest the product best suited to your needs.

Inquiry about products
  1. Products
  2. Chemicals for electronic substrates
  3. Pre-lamination treatment for multilayer substrates (alternative to black oxide treatment)