MEC COMPANY LTD.

Adhesion enhancement

MECetchBOND CZ-8000 series

CZ-8100 CZ-8101 CZ-8201	This organic acid-type microetching solution creates a super-roughened copper surface. This series is widely available for processes where a high level of adhesion is required, such as pre-treatment for build-up resin lamination, dry film lamination or solder mask application.
CZ-8401+AP series	This is a process to improve adhesion on copper surface to form a unique uneven shape and organic film with an ultra-low etching amount. It produces unique copper surface topography with extremely low etching amount, whitch can minimize reduction in line width of conductor patterns.

PWB Roadmap and MEC’s Technologies

PWB

Surface topography

Pattern shape

Peel strength

• CL-8300 is a temporary anti-tarnish treatment for copper surfaces.

Pre-treatment

MECBRITE CA-5330,5340 series

• Pre-treatment MECBRITE
  CA-5330, 5340 series
• Copper surface roughening MECetchBOND
  CZ-8000 series

MECBRITE CA-5330 and 5340 series are H₂SO₄-H₂O₂ type copper surface pre-treatment. They are dedicated pre-treatment agents for MECetchBOND CZ series, the copper surface super-roughening agent. MECetchBOND's performance can be maximized by effectively removing inhibitors on the copper surface with slight etching that may interrupt the effects of the CZ series, such as the residue of dry film adhesives, fingerprints or oxides, thereby improving the final product reliability.

Temporary anti-tarnish, improving chemical adhesion

MECetchBOND CL-8300 series

This anti-tarnish agent protects copper surfaces roughened by the MECetchBOND CZ series from oxidization and creates an organic film that helps to improve adhesion of copper to high Tg resins.

Organic film created by CL-8300 series

Peel strength: 35 μm copper foil (with/without CL-8300 treatment)