MEC COMPANY LTD.

Pre-treatment for subtractive process

MECBRITE CB-5000 series

This H₂SO₄-H₂O₂ type microetching agent creates a uniquely-roughened copper surface topography with a low etching amount, which helps to increase adhesion to resins. It is suitable as a pre-treatment for DFR lamination and solder mask formation. The high copper holding capacity and the excellent hydrogen peroxide stability implicate cost-efficiency.

Surface topography (0.5 μm etching × 3,500, 45°)

Conventional product	CB-5000 series

Pre-treatment for semi-additive process

MECetchBOND STZ-3100

MECetchBOND STZ-3100, an organic acid-type etching solution, produces a super-roughened copper seed surface. It can roughen the copper seed surface with an extremely small etching amount (0.1–0.2 μm), and the ultrafine, roughened topography enhances adhesion to DFR for semi-additive process.

Electroless copper

• Betore treatment
• After STZ-3100 treatment

MECetchBOND STL series

MECetchBOND STL series a copper surface treatment agent that improves adhesion to DFR for SAP with the formed organic film without etching the copper seed surface.

Adhesion evaluation method (dot pattern survival rate)