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DFR pre-treatment

Pre-treatment for subtractive process

MECBRITE CB-5000 series

This H2SO4-H2O2 type microetching agent creates a uniquely-roughened copper surface topography with a low etching amount, which helps to increase adhesion to resins. It is suitable as a pre-treatment for DFR lamination and solder mask formation. The high copper holding capacity and the excellent hydrogen peroxide stability implicate cost-efficiency.

Surface topography (0.5 μm etching × 3,500, 45°)
Conventional product CB-5000 series

Pre-treatment for semi-additive process

MECetchBOND STZ-3100

MECetchBOND STZ-3100, an organic acid-type etching solution, produces a super-roughened copper seed surface. It can roughen the copper seed surface with an extremely small etching amount (0.1–0.2 μm), and the ultrafine, roughened topography enhances adhesion to DFR for semi-additive process.

Electroless copper
  • Betore treatment
  • After STZ-3100 treatment

MECetchBOND STL series

MECetchBOND STL series a copper surface treatment agent that improves adhesion to DFR for SAP with the formed organic film without etching the copper seed surface.

Adhesion evaluation method (dot pattern survival rate)
メックエッチボンド STZ-3100(物理密着タイプ) ドットパターン残存率に関する画像
After each surface treatment, a cylindrical dot pattern having D/S (Dot/Space) = 20/60 μm
and a thickness of 25µm is formed with DFR, and the number of dots formed is counted.
メックエッチボンド STLシリーズ(化学密着タイプ) ドットパターン残存率のグラフ
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