Anisotropic etching
Helps to achieve an improved etch factor and finer patterns with copper chloride etching.
MECBRITE
EXE Series
Compatible with standard acid etching processes.
Features of EXE Series
- 20-times concentrated additive type (5% additive)
- Can improve the etch factor by just adding it to an ordinary copper chloride etching solution.
- Ordinary etching lines can be used.
- General-purpose controller can be used.
- Control margin is wide.
- Both hydrogen peroxide and sodium chlorate can be used as oxidizers.
Anisotropic etching example
Target Drsign L/S(μm) | 25/25 | 30/30 | 40/40 |
---|---|---|---|
DF Design | 31/19 | 36/24 | 45/35 |
DF thickness | 15 | 15 | 25 |
Copper thickness | 20 | 20 | 25 |
EXE | ![]() |
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Conventional etchant | ![]() |
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Test substrate specifications
Copper thickness: 20 μm (regular copper foil 12 μm + plating 8 μm)
Copper thickness: 25 μm (regular copper foil 12 μm + plating 13 μm)
*Electroless copper is included.