MECBRITE

EXE Series

Compatible with standard acid etching processes.

Features of EXE Series

• 20-times concentrated additive type (5% additive)
• Can improve the etch factor by just adding it to an ordinary copper chloride etching solution.
• Ordinary etching lines can be used.
• General-purpose controller can be used.
• Control margin is wide.
• Both hydrogen peroxide and sodium chlorate can be used as oxidizers.

Anisotropic etching example

Target Drsign L/S(μm)	25/25	30/30	40/40
DF Design	31/19	36/24	45/35
DF thickness	15	15	25
Copper thickness	20	20	25
EXE	Top:15.1 Bottom:25.0 EF:4.0	Top:20.0 Bottom:29.3 EF:4.3	Top:32.7 Bottm:41.8 EF:5.5
Conventional etchant	Top:6.9 Bottom:25.1 EF:2.2	Top:14.2 Bottom:32.7 EF:2.2	Top:21.0 Bottom:43.0 EF:2.3

Test substrate specifications
Copper thickness: 20 μm (regular copper foil 12 μm + plating 8 μm)
Copper thickness: 25 μm (regular copper foil 12 μm + plating 13 μm)

^*Electroless copper is included.